塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

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通过涂层配方设计，使底釉和表面涂层膨胀系数基本与牙根基体材料钛合金匹配。

Through designing the composition of the inner glass layer (ig) and the coating, the thermal expansion coefficients of the ig and the coating were matched basically with those of the metal matrix.

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通过涂层配方设计，使底釉和表面涂层膨胀系数基本与牙根基体材料钛合金匹配。

Through designing the composition of the inner glass layer (ig) and the coating, the thermal expansion coefficients of the ig and the coating were matched basically with those of the metal matrix.

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