在硅片研磨过程中，由于应力的积累和剧烈的机械作用，硅片表面损伤严重，碎片率增加。
In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action.
修饰与改性方法包括形成包敷层和金属层、表面氧化、机械研磨以及掺杂等方法。
The methods of modification included the surface covering of graphite with a layer of disorganized carbon or a film of appropriate metal, surface oxidation, mechanical grinding and doping.
分析了W -CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。
The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.
本发明涉及一种用于诸如工件的研磨或抛光之类的表面处理的机械，并且包括旋转筒(1、19)。
The present invention relates to a machine for surface treatment, such as grinding or polishing, of a workpiece and comprises a rotating cylinder (1, 19).
实现钢铁材料表面自身纳米晶化的主要方法有超声喷丸、高能喷丸和机械研磨处理等。
Three methods of surface self-nanocrystallization for iron and steel are ultrasonic shot peening, high energy shot peening and surface mechanical attrition treatment.
实现钢铁材料表面自身纳米晶化的主要方法有超声喷丸、高能喷丸和机械研磨处理等。
Three methods of surface self-nanocrystallization for iron and steel are ultrasonic shot peening, high energy shot peening and surface mechanical attrition treatment.
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