我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。
We developed a non silicon surface micro machining process with two or three mask electroplating layers and using polyimide or photoresist as sacrificial layers.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
表面微机械加工使用选择的材料和干法和湿法蚀刻工艺以形成电路层。
Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.
表面微机械加工使用选择的材料和干法和湿法蚀刻工艺以形成电路层。
Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.
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