表面微机械加工使用选择的材料和干法和湿法蚀刻工艺以形成电路层。
Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.
采用表面微机械加工技术允许多达近100精细的应用在一个芯片上的电路图案层的应用。
Using surface micromachining techniques allows applications of up to nearly 100 finely applied layers of circuit patterns on one chip.
在车辆表面微机械加工的传感器还通过倾斜控制提供保护，防止循环翻转，并在防抱死制动系统的使用。
Surface micromachined sensors in vehicles also provide protection against roll-overs via tilt control, and are used in anti-lock braking systems.
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
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