结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
频率控制和选则用表面安装的压电器件。标准外形和终端引线的连接。第1部分：塑料模压外壳外形。
Surface mounted piezoelectric devices for frequency control and selection - Standard Outlines and terminal lead connections - Part 1: plastic moulded enclosure Outlines.
LPS公司于1995年由一家全球知名跨国企业与国内一家电子企业合资兴建，生产表面安装半导体元器件。
LPS is a joint-venture by a famous multinational company and a home state-own-enterprise founding in 1995, who produces surface mounting semiconductor device.
利用磁吸原理，并通过特殊的结构形式，设计了一种分立式表面安装元器件夹具。
The jig, working on the principle of magnetism, with a special configuration and sharp, is used for aging discrete SMDs.
一种用于半导体发光器件的安装基板包括具有第一和第二相对金属表面的固体金属块。
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces.
一种用于半导体发光器件的安装基板包括具有第一和第二相对金属表面的固体金属块。
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces.
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