目前LED同硅晶片的制作设备类似，都是通过在蓝宝石衬底片上沉淀氮化镓层实现。
At present these LEDs are made in machines similar to those used to make silicon chips, by depositing layers of gallium nitride on sapphire-based wafers.
每一个二极管都是从硅或者蓝宝石薄片上切割下来的。
Each diode is cut from a wafer of crystals layered over a base of silicon or sapphire.
每一个二极管都从硅(或者蓝宝石为衬底的)晶片上切割下来。
Each diode is cut from a wafer of crystals layered over a base of silicon or sapphire.
每一个二极管都从硅(或者蓝宝石为衬底的)晶片上切割下来。
Each diode is cut from a wafer of crystals layered over a base of silicon or sapphire.
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