在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
研制的小型无铅芯片载体封装便于大规模生产探测器，主要用途为便携式摄像机或头盔摄像机。
A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras.
研制的小型无铅芯片载体封装便于大规模生产探测器，主要用途为便携式摄像机或头盔摄像机。
A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras.
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