本发明还提供一种芯片焊接结构。
保证了芯片焊接的准确性。
The probe had greatly improved the accuracy for chip welding.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。
This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.
图中的这位工人在一块钢板表面加热一块电脑电路板以取下焊接在上面的芯片原件。
In this photo, a worker heats a computer board on a steel surface to remove the computer chips soldered into it.
结果之一是，这种激光必须先被分开构造，然后桥接到芯片上，这可比直接焊接在芯片上难得多，而且杀时间。
As a consequence, the lasers have to be constructed separately and then grafted onto the chips, which is more expensive and time-consuming than building them directly on silicon would be.
同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
硬件部分包括芯片选型、原理图设计、PC B布板制版焊接、硬件调试与测试等。
The hardware includes chip selection, schematic design, PCB layout, plate made, welding, hardware debug and test and so on.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
怀疑吸嘴在吸取芯片的时候存在偏差，然后在焊接的时候真空漏气，最终导致了锡料被吸到芯片表面。
I suspect there is a deviation in the draw nozzle chip time, and then when welding vacuum leak, resulting in a tin material is attracted...
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling the three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
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