这些特性将使这些材料非常适合作为电脑芯片散热材料使用。
This characteristic may make the materials ideal for use in drawing heat away from objects that include computer chips.
最后介绍了计算系统功耗的方法和芯片散热设计的注意事项。
The method for calculating power dissipation and some cautions for thermal design are provided in the end.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
这足以让一片没有散热设备的芯片在百分之一秒内被烧毁。
That would destroy an uncooled chip within a hundredth of a second.
每两个视频芯片已经同80毫米风扇的散热器。
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
本文结合目前电子芯片的散热需求，使用流体力学有限元分析软件FLOEFD。
In this paper, with the current demand for electronic chip cooling, using fluid dynamics finite element analysis software FLO EFD.
倒装芯片的应用对出光效率的提高特别是散热处理达到了较好的效果。
Flipchip's applying is good for improvement of efficiency of light emitting of LED and especially for thermal management.
本发明提供一种半导体装置，提高了从多个半导体芯片产生的热的扩散效率，并可靠地与散热路径连接。
The invention provides a semiconductor device which can increase heat diffusion efficiency generated by a plurality of semiconductor chips, and connects with a heat diffusion path reliably.
目前电子芯片对散热的要求越来越高，烧结式吸液芯微热管已经成为电子芯片理想的散热元件。
With the increasing demand for the cooling of electronic chips, the micro heat pipe with the sintered wick has become an ideal heat radiator.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
随着LED芯片发光效率和散热技术的快速提升，显示屏分辨率越来越高，目前填充因子系数已达到10%。
With the rapid promotion of the LED chip light-emitting efficiency and heat dissipation technology, the fill factor coefficient of the LED display has been up to 10%.
高功耗带来的高热量使得芯片的封装和散热装置造价巨增，并存在技术上的限制。
The higher calories which the higher power consumption bring out make the chip encapsulation and coolant device's cost increase more, even there are technique restrictions.
尤其是小型封装的射频芯片底部的大面积铺地很重要，既有利于散热和器件的工作可靠性，又能延长器件的寿命。
Multi-point grounding techniques combined with large areas of paving can enhance anti-interference ability. RF chip's bottom ground. is crucial to discharging heat prolonging the life.
微星满意的是这里有一个简单的散热器复盖了图形芯片。
MSI is satisfied here with a simple radiator covering the graphics chip.
其中一个例子就是第六种元素T1功率芯片，这是安装在水里管的车的散热系统。
One example is the Sixth Element T1 Power Chip, which is fitted onto the water pipe of the car's radiator system.
对各种正装和倒装焊功率型LED芯片的表面温度分布进行了直接测试，对其散热性能进行了分析。
The temperature distribution of power LEDs is measured, and the performance of thermal dispersion is discussed.
并且这种散热装置不仅仅适用于CPU的散热，对其他电子芯片也同样适用，具有较广泛的应用前景，易于推广。
This system is not only applied to CPU chip but also other electronic chips. So it has a wider application prospects, and can be popularized easily.
以计算机芯片为例，传统的散热片与风扇组合式散热器已越来越显现出其弱点与局限性，必须求助于新的解决方案，实现高密度热量的转移。
Take computer chips for example, the traditional heat sink-fan cooler increasingly reveals its weaknesses and limitations, so we must put forward new solutions to deliver this high heat transfer flux.
用于LED芯片和散热器导热连接，解决了散热膏，导热膏难操作，涂不均匀，溢胶造成不良品的难题。
LED chip and heat sink for thermal connection to solve the thermal grease, thermal paste difficult operation, uneven coating, plastic overflow problem caused by defective products.
未检测到芯片集散热器。
未检测到芯片集散热器。
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