第三焊线电性连接于第二芯片与承载器之间。
The third bonding wire is electrically connected between the second chip and the loader.
另外，芯片设置于软性承载器上，以通过信号线连接至显示面板与印刷电路板。
In addition, the chip is arranged on the flexible loader for connecting to the display panel and printed circuit board via signal lines.
此外，软性构装单元包括软性承载器以及芯片，其中软性承载器具有多条信号线与至少一条静电防护线。
Furthermore, the flexible construction unit has a flexible loader and a chip, the flexible loader has a plurality of signal lines and at least a static protecting line.
第二芯片配置于承载器上，并与第一芯片相堆叠。
The second chip is arranged on the loader and is stacked with the first chip.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
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