这些芯片SRAM存储器通常用来获取新的芯片制造工艺调试。
These chips were SRAM memory chips often used to get new manufacturing processes debugged.
多晶硅常用在被称作门的晶体管元件中，已在标准的芯片制造工艺中使用了几十年。
Typically used in the transistor element called the gate, polysilicon has been part of the standard chip-manufacturing process for decades.
虽然实验室里已经造出了原型芯片，但它们采用的特殊材料很难被整合到当今的芯片制造工艺中。
Though prototype chips with optical-communications systems have been built in the lab, they rely on exotic materials that are difficult to integrate into existing chip-manufacturing processes.
目前最先进的芯片制造工艺为30纳米，这意味着芯片元件的平均尺寸为300亿分之一米。
The current state of the art for chip manufacturing is 30 nanometers, which means the average size of a chip component is just 30 billionths of a meter across.
两者都是在一个单独的芯片是45纳米制造的，而仍然在CPU已经死了，是在新的32纳米工艺生产。
Both are on a separate die that is still manufactured in 45nm whereas the CPU die is already manufactured in the new 32nm process.
Intel 22nm制程的工艺代号为1270，首批采用22nm制程技术制作的芯片将由设在俄勒冈州的D1D芯片厂负责制造，而今年下半年晚些时候，这款产品的量产则会在位于亚利桑那的F32工厂开始量产。
The 22-nm process is called 1270 and it is starting to ramp. First wafers will come out of D1D in Oregon and then volume production will start at F32 in Arizona in the later half of this year.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
许多公司具有制造单芯片电脑的工艺技术，但他们不具备所需的智力技术。
Many companies have the process skills to make a PC-on-a-chip, but they don't have the intellectual skills.
在半导体芯片制造过程中，结深是重要的工艺参数之一。
The depth of diffusion junction(Xj)is one of the most important parameters in wafer Fab.
测试是芯片产品规模化生产的重要环节，其目标是检测制造工艺过程引起的电路故障。
Testing is an important process for industrial production of VLSI chips, the goal of which is to detect circuit faults caused by manufacturing process.
正是由于多媒体系统芯片结构的复杂以及采用了先进的半导体制造工艺，给芯片的实现和验证带来了困难。
The implementation and verification of media SoC are difficult because of its complicated architecture and advanced fabricated technology.
正是由于多媒体系统芯片结构的复杂以及采用了先进的半导体制造工艺，给芯片的实现和验证带来了困难。
The implementation and verification of media SoC are difficult because of its complicated architecture and advanced fabricated technology.
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