简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。
This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
介绍了神经元芯片的基本构造和基于神经元芯片的智能探测节点及其在开放式、数字化、多测点的测量与控制系统中的应用原理。
Basic structure of neural chip, intelligent detection node based on neuron chip and its application in open, digital measuring and controlling system are introduced.
介绍了神经元芯片的基本构造和基于神经元芯片的智能探测节点及其在开放式、数字化、多测点的测量与控制系统中的应用原理。
Basic structure of neural chip, intelligent detection node based on neuron chip and its application in open, digital measuring and controlling system are introduced.
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