在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
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