本发明提供用于ULSI半导体器件的具有自组装单分子层的铜线及其制造方法。
A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented.
我们概述了自组装单分子层及其格式化表面研究细胞和表面相互作用的最新进展。
The present paper reviewed the latest research in using patterned self-assembled monolayers to understand surface-cell interactions.
层间电介质、自组装单分子层、在该单分子层上的催化颗粒、以及在具有催化颗粒的单分子层上的铜层。
The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles.
层间电介质、自组装单分子层、在该单分子层上的催化颗粒、以及在具有催化颗粒的单分子层上的铜层。
The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles.
应用推荐