在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
均采用自旋回波（SE）、短时反转恢复（STIR）序列。
All MR imaging was performed by using spin echo(SE)and short time inversion recovery(STIR)sequences.
均采用自旋回波（SE）、短时反转恢复（STIR）序列。
All MR imaging was performed by using spin echo(SE)and short time inversion recovery(STIR)sequences.
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