组合材料芯片技术是用一系列掩膜在同一块基片上获得含不同参数单元样品面阵的方法。
Combinatorial material chip technology provides a new way to fabricate multi-element arrays with different parameters on the same substrate by using a series of masks.
组合材料芯片技术是用一系列掩膜在同一块基片上获得含不同参数单元样品面阵的方法。
Combinatorial material chip technology provides a new way to fabricate multi-element arrays with different parameters on the same substrate by using a series of masks.
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