通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
应用推荐