介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。
Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.
绝缘层上硅硅片用于制造集成电路具有高速、低功耗、集成度高等优势。
SOI (Silicon on Insulator) used for integrated circuit (IC) manufacturing has two advantages of increasing speed and reducing power consumption.
绝缘层上硅硅片用于制造集成电路具有高速、低功耗、集成度高等优势。
SOI (Silicon on Insulator) used for integrated circuit (IC) manufacturing has two advantages of increasing speed and reducing power consumption.
应用推荐