该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。
The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.
该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。
The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.
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