这种结构增强了组装密度。
光纤组装密度高，缆径小，重量轻，是气吹敷设方式的最佳选择。
High dense fiber packed, small diameter light weight; it's the better option fblowing.
光纤组装密度高，缆径小，重量轻，是气吹敷设方式的最佳选择。
High dense fiber packed, small diameter and light weight; it "s the better option for blowing".
光缆组装密度高，缆径小，重量轻，是气吹敷设方式的最佳选择·。
High dense fiber packed, small diameter and light weight; it's the better option for blowing.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
减少电子部件和电路元件的尺寸并增加其组装密度，使其所占空间、电源消耗和信号传输的时延均降低。
The reduction in size and increase in packing density of electronic components and circuit elements, resulting in less space, less power, and less delay in signal propagation.
所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。
The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
并利用自行组装的测试设备研究了柔性石墨板密度、厚度以及空气压力差对相对透气系数的影响。
We also assemble a set of permeability testing equipment, by which we study on the effect of density, thickness and air pressure on the relative permeability.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
实验表明该技术具有结构简单紧凑、易于组装、数据处理密度高和抗环境干扰等优点。
It is shown that the technique is simple and compact in construction, easy to align, capable for high data density and insensitive to environment.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
或者采用进口的高密度多孔聚乙烯材料按健耳的大小和形状切削修整组装形成外耳支架。
Recently the imported porous polyethylene framework of high density has been used for external ear reconstruction by cutting and assembling in accordance with the shape of the normal ear.
电子组装的高密度给传统波峰焊接技术提出了新挑战。
The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology.
不同扩散层所组装的燃料电池最大放电功率密度有较大的差别，碳纤维布扩散层所组装的燃料电池最大放电能量分别是碳纸和碳膜扩散层所组装的燃料电池最大放电能量的2 16倍和6 94倍。
The discharge power density of fuel cell used by carbon fibre cloth diffusion layer are 2.16 and 6.94 times than that of fuel cells used by carbon paper and carbon film diffusion layers respectively.
高速讯号线和个人电脑及电脑周边的高密度组装之电子设备的共模杂讯抑制。
Common mode noise suppression of signal lines in high speed and high density digital equipment as personal computers and peripherals.
利用第一原理密度泛函理论计算组装C60形成能和电子结构，用半经典隧穿理论研究了串联C60的电子输运特性。
The formation energy and electronic structures of the series-connected C60 molecule are calculated by the ab initio density–functional theory.
适用于高密度表面组装。
追求良好而坚固的工艺，不仅是产品质量的要求，也是高密度组装的客观需要。
The pursuit of good and strong technology, is not only the requirements of the product's quality, is also the objective demand of the high density assembly.
适用于高密度表面组装。
适用于高密度表面组装。
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