本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料，用于生产低到高层数的PTFE多层板的情况。
This article describes the different types of applications, bonding films, equipment needs, and bonding methods used to produce low-count and high-count PTFE multiplayer boards.
介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料，用于生产低到高层数的PTFE多层板的情况。
This article describes the different types of applications, bonding films, equipment needs, and bonding methods used to produce low-count and high-count PTFE multiplayer boards.
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