结果表明，当磨粒尺寸较小时，锯丝与晶体间的膜厚大于磨粒尺寸，磨粒悬浮在研磨液中，因此研磨液中磨粒与晶体的碰撞将是材料去除的主要因素。
The results show that the film thickness between saw wire and crystals is larger than the size of abrasives, abrasives suspend in the slurry when the size of the abrasives are small enou…
结果表明，当磨粒尺寸较小时，锯丝与晶体间的膜厚大于磨粒尺寸，磨粒悬浮在研磨液中，因此研磨液中磨粒与晶体的碰撞将是材料去除的主要因素。
The results show that the film thickness between saw wire and crystals is larger than the size of abrasives, abrasives suspend in the slurry when the size of the abrasives are small enou…
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