以及保护环布线，贯通上述第二区域的上述第一及第二主面的两面而形成于上述半导体基板，并包围上述至少一个贯通电极。
A guard ring is formed in the semiconductor substrate to penetrate the first and second principal faces, the guard ring is surrounding the penetrative electrodes.
以及保护环布线，贯通上述第二区域的上述第一及第二主面的两面而形成于上述半导体基板，并包围上述至少一个贯通电极。
A guard ring is formed in the semiconductor substrate to penetrate the first and second principal faces, the guard ring is surrounding the penetrative electrodes.
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