电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
本文分析了该控制系统的组成、传递函数和稳定性，还分析了该系统的频率特性、时域响应和稳态误差。
This paper analyses the composition, transfer function and stability of the control system. It also analyses the control performance index of frequency characteristic, time-domain response and steady…
本文分析了该控制系统的组成、传递函数和稳定性，还分析了该系统的频率特性、时域响应和稳态误差。
This paper analyses the composition, transfer function and stability of the control system. It also analyses the control performance index of frequency characteristic, time-domain response and steady…
应用推荐