稳定镀液和镀液的维护是保证电镀质量的必要条件。
Steadying and maintaining plating liquid is the essential condition of the guarantee to electroplate quality.
阳极活化剂含量不足时阳极溶解不正常﹐主盐的含量下降较快﹐影响镀液的稳定。
The anode activator content is insufficient an anodic dissolution is not normal, Lord of the salt levels in the stability of solution, influence faster.
通过对爆轰制备的纳米金刚石粉进行去除杂质，亲水处理，制备出分散稳定的含纳米金刚石粉的镀液。
After impurities removing and hydrophilic treatment of nano -diamond powder(ND) obtained from detonation, a stable plating bathe containing ND powder is achieved.
结果表明：该工艺镀液稳定、易于维护，所得镀层光亮、结合力好、抗变色能力强。
The results show that the process has strengths such as high bath stability, easy maintenance, bright deposit, good adhesion and antitarnishing ability.
选择硫酸盐-柠檬酸盐体系锌锰合金镀液，研究了阳极、二价锰离子以及连续作用等因素对镀液稳定性的影响。
Herein, zinc-manganese alloy bath containing sulfate and citrate ions was selected, and the effect of anodes, manganous ions and continuous operation on bath stability was studied.
该镀液长时间使用后能保持电流密度范围稳定。
The range of current density is still stable after the bath is used for a long time.
在瓦特镍镀液中加入添加剂后获得较稳定的悬浊液，利用这种镀液制得珠光效果良好的珍珠镍镀层。
A very stable emulsion was obtained with addition of one additive in Watts nickel electroplating bath. Using the emulsion an even satin-finished nickel coating was prepared.
使用分子筛型镀液添加剂对提高镀层厚度、镀层结合力及其稳定性都非常有利。
Using molecular sieve type plating solution additive is very favorable to raising coat thickness, coat adhesion and its stability.
研究了镀液中稳定剂、平滑剂、光亮剂、表面活性剂含量及操作条件对镀液及镀层性能的影响。
The influences of operation conditions and the contents of stabilizer, smoothing agent, brightener and surfactant on the properties of the solution and the deposits were studied.
结果表明：碳纳米管球磨后加入到镀液中，并通过超声分散，可以得到稳定的复合电镀液；
The results indicated that CNTs were stably suspended in nickel bath after ball-mill treatment and supersonic dispersion.
锌合金镀层可以在适宜的镀液中比较容易的沉积出来，它具有优异的耐蚀性、低氢脆性和化学稳定性，已引起人们的极大关注。
Zinc alloy coatings can be obtained from suitable range of bath, and it has attracted a great attention due to their unique high corrosion resistance, low hydrogen brittleness and chemical stability.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
镀液的覆盖能力和分散能力良好，镀液稳定性也得到较大提高。
The throwing power, covering ability and stability of the bath were good.
实验结果表明，随着镀液中微粒加入量的增加，镀层中的微粒量也增加，以后含量增加缓慢，逐渐达到稳定状态。
The results show that the particles in the Ni-P deposits increase as the adding particles to the bath increase, then the increase slows down until in the end it comes intos stable state.
另外，本文从热力学、动力学上对镀液稳定性机理，对纳米复合镀的共沉积机理作了初步的讨论。
In addition, the paper made preliminary step discuss on the mechanism of stability of bath on the thermodynamic and dynamic aspects and electroless composite codeposition using nano powder.
稳定剂可以防止镀液的自分解，氧化亚钢产生，适当的含量是对获得好的镀层是非常关键的。
That is important factor to get better composite material . the factors which affected composition affected the thickness and the uniformity of the plate too.
通过对镀液配方的筛选并添加了增速剂和稳定剂，开发出新的镀镍液。
A new nickel -plating liquor has been developed through bolting experiments of plating liquor's compounding with accelerators and stabilizers.
实验结果表明，在酸性镀液中加入TUM系列添加剂可以明显改善镀液的稳定性。
It is proved through experiments that the stability of the acid bath has been greatly improved after adding the series of TUM additives in it.
文中针对化学镀金中镀液组分的主盐与络合剂、稳定剂和缓冲剂的筛选与优化等关键技术进行了研究和阐述。
This paper studied and discussed the determination and optimization of the principal salt, complexing agent, stabilizer, and buffering contained in plat...
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
稳定剂提高了镀液的稳定性，通过混合电位-时间曲线的研究和其对镀液稳定时间和镀速的影响，确定了稳定剂的加入量。
The stabilizers can improve the stability of the bath. The dose of the stabilizers is determined by studying the mixed potential-time curves and the impact of stabilizing time on the plating rate.
同时介绍了描述稳定剂吸附的几个模型，并指出稳定剂的研发是今后镀液稳定性得以提高的关键。
The key for research and development of stabilizers is to improve the stability of electroless plating bath.
造成稳定性较差，一般镀液仅能使用4 ~5个周期，化学镀液的稳定性是制约化学镀镍的一个重要因素。
Caused by poor stability, the general solution can only use 4 to 5 cycles, the stability of the chemical bath of electroless nickel plating restricting an important factor.
该镀锡工艺配方简单，镀液稳定，操作简便，着色后的膜层深黑，牢固。
The Sn plating process features simple formulation, stable bath and convenient operation. The colored films are pitch black and durable.
镀液稳定容易控制，可以代替部分挂镀铬和全部滚镀铬。
The plating bath is stable and easy to control, it can substitute all rack plating chromium.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
硫酸铜和UPS的加入不仅能够提高镀层的光亮性和镀液稳定性，而且能够有效的降低镀层的磷含量。
The addition of bluestone or UPS not only can increase the brightness of the layer or the stability of the solution, but also can decrease P content of the layer availably.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
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