积体电路产业区：规划面积1.6平方公里。
Integrated Circuit Industrial area: The planned area is 1.6 square kilometers.
我们进入了第四种模式，即晶体管，最后是积体电路。
We went to the fourth paradigm, transistors. And finally integrated circuits.
由于超大型积体电路技术在尺寸上的缩减，高效能的数位系统能被实现。
Due to the scaling in VLSI technology, high performance digital systems can be realized.
本电源采用脉冲宽度调节（PWM）开关技术设计，由专业积体电路组成，可靠性高。
The power adopt PWM switch technic design, it compose of professional IC, and high reliability.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
半导体、二极体、双极电晶体、场效电晶体、电晶体放大器、频率响应、算放大器、差动及多极放大器、积体电路。
Semiconductor diodes bipolar junction transistors field-effect transistors transistor amplifiers frequency response operational amplifiers differential and multistage amplifiers integrated circuits.
我们帮助确保漂亮的图画，几乎任何情况下，我们有灵活的图像信号处理器和一体化的大型积体电路(SOC)的解决方案。
We help ensure beautiful pictures in virtually any scenario, and we do it with flexible image signal processors and all-in-one system-on-chip (SOC) solutions.
我们已经达成这不只有借由递送一个新一代的有成本效益的积体电路，但是也提供根据客户需要而修改的系统设计给客户-在服务和支持。
We have achieved this not only by delivering a new generation of cost-effective ICs, but also providing clients with customized system design-in services and supports.
随著积体电路中线路之间的距离越来越小且整个电路的运算速度也越来越快，因此交感杂讯（crosstalknoises）和瑕疵点（spotdefects）的问题亦日趋重要。
As interconnection wire spacing becomes smaller and the circuit operating frequency runs higher, the problems of crosstalk noises and spot defects become very crucial.
随著积体电路中线路之间的距离越来越小且整个电路的运算速度也越来越快，因此交感杂讯（crosstalknoises）和瑕疵点（spotdefects）的问题亦日趋重要。
As interconnection wire spacing becomes smaller and the circuit operating frequency runs higher, the problems of crosstalk noises and spot defects become very crucial.
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