利用并行直写技术与感应耦合等离子刻蚀技术制作了部分二元光学元件。
Some binary optical elements were manufactured by parallel direct writing and inductive couple plasma etching technology.
本文简要介绍了微波ECR等离子体技术的原理，评述了近年来这种技术在CVD、PVD、刻蚀等方面的研究和应用的进展。
Principles of microwave ECR plasma technology are introduced briefly. Present development of it'S research and applications in system manufacturing, CVD, PVD and etching is reviewed.
衍射光学元件的制作技术主要包括激光或电子束直写、反应离子刻蚀、离子束铣及薄膜沉积。
DOE's fabrication techniques mainly include laser beam or electron beam writing, RIE, ion milling and thin film deposition.
等离子体低温刻蚀是一种针对高深宽比结构的干法刻蚀技术。
High aspect ratio structures have been successfully fabricated by plasma cryo-etching on silicon wafers.
在薄膜沉积和离子束刻蚀技术中，通常要给绝缘基片加上一个射频或脉冲电极，以便在绝缘基片上形成一个自偏压来控制轰击到绝缘基片表面的离子能量。
Self-bias voltage of the dielectric substrate surface and voltage of the driven electrode were experimentally studied to improve the energy control of impinging ion in plasma processes.
新兴的3d互联技术以及高产量的MEMS应用需要成本低廉以及高产量的深层反应离子刻蚀系统。
Emerging 3d interconnection technologies and high volume MEMS applications require cost effective mass production DRIE systems.
摘要 ：总结了大尺寸衍射光学元件离子束刻蚀技术的研究进展。
Abstract : Ion beam etching technologies for developing large aperture Diffractive Optical Elements (DOEs) were reviewed.
应用于啁啾脉冲放大技术中的脉宽压缩光栅是基于多层膜作为基底，利用全息干涉技术和离子束技术刻蚀而成。
Pulse compressed gratings (PCG) used in chirped-pulse amplification system and based on multi-layer thin film stack are etched with ion-beam and holographic techniques.
提出一种基于等离子体刻蚀的技术，形成减反射表面结构。
A technology based on plasma etching has been developed to produce antireflective surface structures.
采用感应耦合等离子体刻蚀技术实现了不同形状和几何参数的规则织构化硅片表面的构筑与制备。
Regular textured silicon surfaces with various shape and different geometrical parameters were successfully designed and prepared using inductively coupled plasma (ICP) etching technology.
采用感应耦合等离子体刻蚀技术实现了不同形状和几何参数的规则织构化硅片表面的构筑与制备。
Regular textured silicon surfaces with various shape and different geometrical parameters were successfully designed and prepared using inductively coupled plasma (ICP) etching technology.
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