近年来，高压磨料水射流这种新兴的加工工程陶瓷的方法越来越受到人们重视。
In recent years, more and more importance has been attached to the new machining method of engineering ceramics, i. e. abrasive water -jet.
磨料水射流复合电解光整加工是在磨料水射流作用的基础上复合电解加工。
The process of abrasive water jet (AWJ) compound with electrolytic machine is based on AWJ.
磨料水射流抛光技术是应用于表面抛光加工的新技术。
Polishing technique of abrasive water jet (AWJ) is an advance process which can be applied to surface polishing.
不仅适用于磨料水射流切割机，也可用于其它类似加工设备的控制。
It is suitable for the abrasive water-jet cutter as well as other similar processing equipment.
作者在玻璃上进行微磨料水射流微细槽加工的实验基础上，对微磨料水射流加工的表面形貌、材料冲蚀去除机理及加工工艺性能进行了研究。
This paper presents a study of using micro-abrasive water jet for the machining of micro-channels on brittle glasses. The erosion mechanism, surface pattern and process performance are studied.
微磨料水射流加工技术正成为制造微细结构零件重要的经济高效的微细加工技术。
Micro abrasive water jet machining (MAJM) is becoming an important machining technique for cost effective micro machining.
适当地控制加工工艺参数，在低压下，微磨料水射流加工是一种用于脆性材料上微细通道的加工切实可行的方法，并可获得良好的加工表面质量。
With proper control of the operating parameters, this technology can be used for machining micro-channels on brittle materials with high quality of surface finish.
磨料水射流加工孔的直径和深度随靶距的增加而增加。
The diameter and depth of the holes eroded by HPAWJ increase with the increase of stand-off-distance.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
应用推荐