磨料水射流加工在切口形成过程中出现冲蚀延时现象，从而在直线切割时形成切口斜度，在圆形零件切割时形成切口锥度。
Phenomenon of erosion delay in forming kerfs by abrasive waterjet will cause kerf incline in straight cutting or kerf taper in circular cutting process.
不仅适用于磨料水射流切割机，也可用于其它类似加工设备的控制。
It is suitable for the abrasive water-jet cutter as well as other similar processing equipment.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
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