堆焊硬金。
主要用途：制造蓄电池电极板、硬金、印刷合金、电缆套管及轴承合金等。
Main usage: the product is mainly used in manufacture of the battery electrode plates, the hard gold, printing alloy, cable sets and the bearing alloys, etc.
简要论述了电子工业中接插件硬金镀层的耐磨机理，获得硬金镀层的镀液，节金代金以及镀金层的质量检测等问题。
The present paper deals with the bath for hard gold plating, the quantity controll and the wear mechanism of coatings as well.
更多更早地出现贵重硬币。金、硬、铜币出现在路径上。
More valuable COINS appear sooner. Gold, Silver and Copper COINS appear in the path.
手镯环为中空环形结构，采用硬塑或轻金属，外表面镀（涂）金、银及装饰涂料。
The outer surface of the bracelet ring is coated by gold, silver and decorative coating. The connecting device can adopt a spring or a snap buckle sheet.
手镯环为中空环形结构，采用硬塑或轻金属，外表面镀（涂）金、银及装饰涂料。
The outer surface of the bracelet ring is coated by gold, silver and decorative coating. The connecting device can adopt a spring or a snap buckle sheet.
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