这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
水平驱动光开关采用单层体硅结构，另外两种光开关都采用了硅-玻璃的键合结构。
The first is formed with monolayer bulk silicon structure, the others use the silicon on glass bonding structures.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
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