硅键合片的缺陷主要集中在键合界面，键合强度受到很大影响。
That defects are mainly in interface of SDB affects bonding strength.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
根据煤矸石硅铝基胶凝材料的特征提出了原位键合的水化机理。
Based on the properties of gangue-containing aluminosilicate based cementitious materials, in situ bonding hydration mechanism was put forward.
水平驱动光开关采用单层体硅结构，另外两种光开关都采用了硅-玻璃的键合结构。
The first is formed with monolayer bulk silicon structure, the others use the silicon on glass bonding structures.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
硅片键合强度达到了体硅的强度。
用表面增强拉曼散射技术研究单晶硅表面键合光敏染料，可获得信噪比强的SERS图。
The photosensitive dye bound to the monocrystalline silicon surface was investigated by means of SERS, and SERS which had strong signal-to-noise ratio (SNR) was obtained.
该方法应用于快速测定键合硅铝丝中的各种元素，结果满意。
Si and impurity elements of Fe and Cu in aluminum-silicon bonding wires were determined by inductively coupled plasma atomic emission spectrometry.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
传感器的结构建立在SOI材料上，在关键工艺中采用硅熔融键合技术。
The structure, which is fabricated on the SOI material, and its fabrication process have been designed based on the theoretical analysis.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
在反相体系中，研究了十八烷基键合相表面残留硅醇基对杂多酸阴离子保留行为的影响。
In the reversed-phase system, the influence of residual silanol groups of C18 bonded phase surface on the retention behaviors of heteropoly acid (HPA) anion is studied.
报道了一种利用硅乳胶作为键合介质的新型键合技术。
A novel bonding method using silicate gel as bonding medium is developed.
报道了一种利用硅乳胶作为键合介质的新型键合技术。
A novel bonding method using silicate gel as bonding medium is developed.
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