我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。
We developed a non silicon surface micro machining process with two or three mask electroplating layers and using polyimide or photoresist as sacrificial layers.
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
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