这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
应用推荐