硅片直接键合（SDB） 技术的关键在于硅片表面的亲水处理，本文分析了亲水处理之微观机理。
Successful Silicon to silicon direct bonding(SDB)mainly depend on the hydrophilicity treatment of silicon surface. Micro mechanism of hydrophilicity has been analyzed in the paper for the first time.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
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