本发明与传统的硅片清洗剂相比单位成本下降近60%。
Compared with the traditional silicon slice detergent, the unit cost is reduced by about 60%.
用混合酸、清洗剂和纯水在清洗槽或超声波清洗机内清洗硅片，使其表面洁净并烘干。
Wash the wafers with mixed acid, lotion and UPW (ultra pure water) by ultrasonic cleaning in wet sinks to get a clean and dry surface of wafers.
用混合酸、清洗剂和纯水在清洗槽或超声波清洗机内清洗硅片，使其表面洁净并烘干。
Wash the wafers with mixed acid, lotion and UPW (ultra pure water) by ultrasonic cleaning in wet sinks to get a clean and dry surface of wafers.
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