对界面反应层的观察表明，反应层分为两层结构。
The observation of interfacial reaction layer showed that it is a two-layer structure.
在连接温度为1403K的条件下，随着连接时间的增加，界面反应层厚度先快速增加，再缓慢增加。
When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.
激光能量对电极表面的作用及界面溶液层的影响加速了电子转移并提高了电极反应的灵敏度。
Acceleration of electrons transfer and a rise in sensitivity of electrode reaction result from the effect of laser energy to electrode surface and interface solution layer.
实验数据与界面化学反应和固体产物层内扩散共同控制数学模型相吻合。
The experimental data were fitted to a mathematical model of joint controlled by the chemical reaction at the interface and diffusion of steam through the product layer.
设计了一个数值模型来模拟一个反应物在明胶层中边扩散边在油珠界面上与另一个反应物反应的动力学过程。
A numerical model was designed to simulate the kinetic process of diffusion and reaction of one reactant with another on the interface of droplets in a gelatin layer.
研究了一种新型钛合金精密铸造用型壳——氮化硼基复合型壳及其与钛镍合金的界面反应和反应层的形成机制。
A new kind of boron nitride based shell mold used for investment casting titanium alloys was fabricated and the reaction between it and Ti-Ni alloy was investigated.
结果表明，炉管的氧化机理主要是金属离子穿过氧化物层的扩散并在氧化物—气体界面发生反应。
The results show that oxidizing mechanism of the heater tube is mainly diffusion of metal ion passing through oxide and its reaction at the oxide-gases boundary.
进一步，通过有限元数值模拟方法计算了界面不同位置的热循环曲线，进行了不同热输入条件下反应层厚度的预测。
Further, according to thermal cycle calculated by the finite element method, the thickness of reaction layer was predicted in the case of different heat input.
大颗粒WC颗粒周围形成了厚达数微米的反应层，界面结合强度大为提高。
The interface between large WC particles and steel matrix forms the reaction layer of several mms which enhances the toughness of interface highly.
结果表明，采用界面聚合反应在PAN改性膜上已复合一层致密的表皮层，该致密表皮层是聚酰胺结构。
The results showed that a dense skin layer, which is a kind of polyamide structure, had been combined with the modified PAN substrate surface due to the interfacial polymerization.
结果表明，采用界面聚合反应在PAN改性膜上已复合一层致密的表皮层，该致密表皮层是聚酰胺结构。
The results showed that a dense skin layer, which is a kind of polyamide structure, had been combined with the modified PAN substrate surface due to the interfacial polymerization.
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