也就是说，在电镀过程中当晶核的生成速度大于晶核的成长速度时，就能获得结晶细致、排列紧密的镀层。
That is, in electroplating process when the generation of the nucleation speed is greater than the growth of the nucleation rate, it can get meticulous, crystallization of closely spaced coating.
例如，要电镀的注塑件在电镀时会经受酸溶液，必须采用很低的注塑速度制造以使表面方向性最小化。
For example, moldings that are to be electroplated, and will be subject to acid solutions during plating, must be made using very slow injection speeds to minimize surface orientation.
这些变化都加快了电沉积速度，使高速局部电镀有可能实现。
All these changes enhance electrodeposition rates, thus high-speed selective electroplating can be reached.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
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