研制磨擦辅助精密电铸机床，开展磨擦辅助精密电铸技术的应用研究。
An APEF machine has been developed, and the applications of APEF have been researched.
与常规电铸技术相比，用磨擦辅助精密电铸技术所制备电铸层的材料性能显著提高。
Comparing with the deposits produced by conventional electroforming technology, the deposits produced by APEF exhibited better properties.
采用深度光刻与电铸技术相结合的方法，较好地解决了大深宽比的电火花工具电极的制造问题。
EDM tool electrode with high aspect ratio is produced successfully by combining deep lithography with electroforming.
试验结果显示，与常规电铸技术相比，用磨擦辅助精密电铸技术所制备的镍电铸层和铜电铸层的组织结构均发生明显变化。
It was found in experiments that the microstructure of nickel and copper deposits produced by APEF significantly changed in contrast with the conventional electroforming technology.
试验发现，游离粒子磨擦能彻底消除析氢的不利影响，利用磨擦辅助精密电铸技术能够制造出没有任何麻点、针孔等缺陷的镍电铸层。
It was found in experiments that the particle polishing could eliminate the passive effect of hydrogen evolution and nickel deposits electroformed without pinholes and pits could be achieved by APEF.
钢网制作技术包括化学腐蚀，激光切割和电铸。
Stencil manufacturing techniques include chemical etching laser cutting and electroforming.
开展了微细电化学加工技术的试验研究工作，内容包括微细电铸和微细电解加工。
This paper is focused on developing micro electrochemical fabrication processes, including micro electroforming and micro electrochemical machining.
微电铸，又称精密电铸，是一种全新的微细加工技术。
As a new micro fabrication technology, micro electroforming I.
介绍了快速成型技术及其在电铸中的应用。
Rapid prototyping technology and its application in electroforming are introduced.
电铸是一种利用金属离子阴极电沉积原理来制取金属零件的工艺技术，具有极高的复制精度。
Electroforming, which possesses the merit of high manufacturing precision, is a manufacture technology that is based on principle of cathodic metal deposit.
利用SU -8光刻胶为主要材料，采用多级曝光和电铸金属实现3D结构的工艺技术，研制出了微针执行器的雏形器件。
The rudiments of microneedle actuator have been developed, which is mainly made of SU 8 photoresist, and its 3D construction is fabricated by multistep exposal and electroforming metal.
无背板生长法是利用SU - 8光刻胶，通过低成本的UV -LIGA技术，直接在金属基板上电铸镍图形来实现的。
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
利用LOM原型，把化学镀、电铸和电弧喷涂技术结合起来快速制造电火花加工电极，是实现模具快速制造的有效途径。
A technique of rapidly manufacturing EDM electrode based on LOM prototype through the combination of electroless plating, electroforming with wire arc spraying was investigated.
介绍了电铸与其它工艺的结合，如电弧喷涂、连接技术、微机械技术、快速制模技术等。
The methods of refining grains to improve the electroforming quality were analyzed, including changing power, adding additive, using combined advanced technologies and using ejecting and so on.
本文主要阐述了LIGA技术的工艺过程，包括X射线深层光刻、微电铸和微复制工艺。
This article mainly explains the process of LIGA technology, which includes X-ray mask lithography, Micro-electroforming and Micro-copy.
研究结果表明，采用射流电铸快速成型技术可直接成型纳米晶金属零件和三维大块体纳米晶材料。
The result shows that nanocrystalline metal parts and dimensional bulk nanocrystalline metal materials can be fabricated rapidly by the technology of rapid prototyping oriented jet electroforming.
电铸作为一种精密制造技术，在许多高技术领域得到成功的应用。
As an accurate manufacture technology, electroforming is successfully applied in many high tech fields.
文内给出了精密电铸设备的技术参数、系统结构、软件流程及初步实验效果。
The paper gives the technical parameters, the structure, the control Software and the initial experiment results of the device.
电铸作为一种精密制造技术，在许多高技术领域得到成功的应用。
An accurate manufacture technology-electroforming is successfully applied in many high technology fields.
介绍了射流电铸快速成型技术的基本原理与设备系统组成，并进行了基础试验研究。
The theory and the system components of jet electroforming orientated by rapid prototyping are presented, and the fundamental experiments are achieved.
采用线性电位扫描和电化学交流阻抗等电化学测量技术 ，对高深宽比掩膜条件下微电铸镍的电极反应动力学过程进行了初步研究。
The kinetics of the electrode reaction is preliminarily studied by linear potential sweep technique and electrochemical impedance while electrodepositing Ni for high aspect ratio structures.
这使电铸成为高密度应用，比如晶片封装优选技术。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
这使电铸成为高密度应用，比如晶片封装优选技术。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
应用推荐