覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。
Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.
覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。
Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.
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