印刷电路板组装清洗后，常常留有许多白色残渣，这些残渣由许多的化学物反应而成。
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions.
本文主要介绍了印制电路板组装件焊接后非ods清洗剂清洗质量表征参数的测量方法。
The measurement method of the characteristic parameters of the cleaning quality about welded printed circuit board assembly cleaned by non-ODS cleaner is introduced in this paper.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
本发明的门极换流晶闸管易于与印刷电路板组装，且使得门控晶闸管与印刷电 路板组成的器件易于维护。
The gate commutated thyristor is easy to be assembled with the printed circuit board, and ensures that a device consisting of a gating thyristor and the printed circuit board is easy to maintain.
针对目前印刷电路板组装件(PCBA)检测存在的问题，从经济、快捷、可靠的角度出发，提出了一种新的检测方式。
Being faced with the problems found in detection of printed circuit board assembly (PCBA) at present, a new method of PCBA detection which is economical, rapid and reliable is promoted.
硬件设计包括电路的系统规划、设计、抗干扰电路的设计、原理图的绘制、PC B电路板的制作、电路的焊接、电路的调试以及整个系统的组装。
Hardware include the whole programming of circuit, design, anti-jamming circuit, principal chart of circuit, the circuit board of PCB, jointing the circuit, debugging and assemble the system.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
如今很多电子产品制造商已经意识到，有必要在印刷电路板（PCB）组装线上采用X射线检测系统。
Many electronics manufacturers realized it is necessary to implement the X-ray inspection systems in the PCB assembly line.
本发明提供一种散热模组组装治具，其用于将散热模组组装于电路板上。
The invention provides an assembly fixture for a heat dissipation module, which is used for assembling the heat dissipation module on a circuit board.
一种测压模块(15)的组装方法包括将压力传感器单元(30)附接到对准工具(100)上并将对准工具(100)标引到电路板(28)上。
A method of assembling a pressure sensing module (15) includes affixing a pressure sensor unit (30) to an alignment tool (100) aod indexing the alignment tool (100) to a circuit board (28).
这就需要在组装过程中的每个阶段检验电路板的质量。
And we need to control the quality and detect the bugs at every phase during the assembly.
这时候有LC表真有帮助，因为可以确认组装后的电感值 - 你应该有发现我没有用电路板。
This time I also did not calculate the coil, but instead used my AADE LC meter to wind the coil to the correct value.
这时候有LC表真有帮助，因为可以确认组装后的电感值 - 你应该有发现我没有用电路板。
This time I also did not calculate the coil, but instead used my AADE LC meter to wind the coil to the correct value.
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