本发明公开了一种对电解铜箔的表面进行低粗化的处理方法。
The present invention discloses one low roughening treatment process for the surface of electrolytic copper foil.
过滤器是电解铜箔生产中的关键的设备，直接影响产品的质量。
Filter vessel is the pivotal equipment in the production of electrolytic copper foil. It effects quality of product directly.
研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。
The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied.
经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。
After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。
This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
该文简要地介绍了电解铜箔生产的溶铜工艺过程中多项反应的物理化学过程。
This paper brief introduces the Physical chemistry process of heterogeneous response in the technical process of copper dissolved for produced process of electrodeposited copper foil.
美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.
美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.
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