文中还提供了对一个简单电真空器件模型的模拟计算。
A simple electrical vacuum device model is described in this paper, some simulations are given afterwards.
密封电真空器件的可靠性尤其重要，而影响其可靠性的主要因素是真空度。
Reliability of the sealed vacuum device is very important, and the main reason that affects reliability is its vacuum.
微波电真空器件是雷达、通信、广播、加速器等一些电子系统的心脏部件。
Microwave vacuum electron devices are the key components in Radar, communication, broadcasting, accelerators and the other electron systems.
鉴别电真空用金属材料真空性能的好坏，对电真空器件的生产有直接帮助。
Identifying the vacuum property of metal materials is very helpful to the manufacture of electronic devices.
陶瓷绝缘子沿面闪络是制约电真空器件绝缘性能、影响设备正常运行的关键因素之一。
Surface flashover of ceramic insulators used in vacuum devices restricts the insulating properties of the vacuum devices.
在微波、毫米波领域，尤其是微波通信中微波电真空器件一直都是不可或缺的电子器件之一。
It is one of an indispensable electrical device for microwave vacuum devices in fields of microwave or millimeter wave, especially in microwave communication.
高真空系统残气分析对提高电真空器件的性能、质量和寿命具有重要作用。四极质谱计与微机联用是必然的趋势。
The application of the residual gases analysis in high vacuum system is very important for improving the performances, the quality and the working life of various vacuum electronic devices.
研究表明铠装钨铼合金的阴极加热材料具有优良的电性能，是一种制造高可靠性电真空器件阴极加热器的理想材料。
It also covers the properties of this material. The result show it's a reliable materials for manufacturing the cathode heater.
希望能为电真空用氧化铝陶瓷的质量控制和检验提供理论依据，同时也为工艺方法(包括材料工艺和电真空器件工艺)的选择提供有益的技术参考。
It is anticipated that the results should provide a helpful reference for quality control of alumina ceramics, as well as the technologies with respect to materials and vacuum electronics.
广泛适用于铝、铜、钨、镍、铁、不锈钢等多种金属片、丝、棒的焊接以及电池，电真空器件，电子元件，小五金和热工测量仪表内部结构的装配和焊接。
Widely used in the welding of aluminum, copper, iron, stainless steel, and some vacuum wares, electronic components and the inner structures of the thermal measuring instruments.
广泛适用于铝、铜、钨、镍、铁、不锈钢等多种金属片、丝、棒的焊接以及电池，电真空器件，电子元件，小五金和热工测量仪表内部结构的装配和焊接。
Widely used in the welding of aluminum, copper, iron, stainless steel, and some vacuum wares, electronic components and the inner structures of the thermal measuring instruments.
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