主要之制程参数包括气源中之氢气含量、电浆前处理、材偏压、积温度以及电浆导流板之施加。
The main process parameters include hydrogen content in the gas sources, hydrogen plasma catalyst pretreatment, substrate bias, deposition temperature and plasma flow guiding.
直到电浆纯量波网格得到妥善处理之前，事件都不会发生。
The Event will NOT happen until the scalar plasma grid is taken care of.
在频域有限差分法使用上，我们用边界条件去处理金属和介质之间的边界，故能精确模拟出金属表面电浆波在近场的分布情形。
We match the boundary conditions to take care of the interface between the metal and the dielectric in the FDFD method. Thus the SP wave distribution on the metal surface can be accurately simulated.
本论文中，我们尝试使用一氧化二氮电浆氮化处理，以改善二氧化铪闸极介电层的品质。
In this thesis, we try to use post-deposition N2O plasma nitridation to improve the HfO2 film quality.
本论文中，我们尝试使用一氧化二氮电浆氮化处理，以改善二氧化铪闸极介电层的品质。
In this thesis, we try to use post-deposition N2O plasma nitridation to improve the HfO2 film quality.
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