• 装置外观即为夹子容器电极电极引线固定在夹子上。

    The device looks like a clamp, and has liquid container, electrode, leading wire, etc fixed onto the clamp.

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  • 适用多层布线作细线导体适用敏传感器电极电极引线焊接材料

    Applicable for thin multi-layer wiring conductor, also apply to gas sensors for welding electrodes and electrode-lead material.

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  • 光盘包含至少一个线性天线振子,它例如电极引线连接转发器数据区内延伸

    The optical disk further comprises at least one linear antenna element coupled to the transponder, e. g., via pole lead (s), and extending within the data region.

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  • PC-Au - 4910导体浆料适用多层布线作细线导体,适用敏传感器电极电极引线焊接材料

    PC-Au-4910 gold conductor paste suitable for thin multi-layer wiring conductor, also apply to gas sensors for welding electrodes and electrode-lead material.

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  • 必须牢固地安装单元电极避免其振动移动产生噪声干扰此外引线屏蔽也有助于降低干扰

    The electrodes of the cell must be rigidly mounted to prevent vibration and motion from creating noise and pickup. Additionally, shielding the leads to the electrodes helps reduce interference.

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  • 聚酯有感结构环氧树脂包封体积,重量引线直接电极,损耗小。

    Polyester film feeling construction, inductive, epoxy resin coating. Small size and light weight. Small dissipation factor, the leads directly welded to electrodes.

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  • 是个玻璃这里有些引线,可以使电极射击

    This is a glass tube. There are some feedthroughs here to allow electrodes to be potted.

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  • 超级电容器主要极化电极电极、电解质、隔离膜引线封装材料部分组成部分的组成、结构均对性能有重要影响

    It consists of polarized electrode, collector, electrolyte, separator, lead and packing material, and its performances are affected by the composition and structure of each component greatly.

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  • 通过采用引线电极垂直引线技术使引线回路中的附加感生电动势降低未采用10%,提高系统的总体精度。

    By use of the technique of twisted pair wire, the additive EMF in the circuit of the electrode leads has been reduced to 10% of that before use and the precision of the system has been improved.

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  • 本文提出和研究了一可用于兆巴压力冲击压缩测量金属电导率方法——电极引线法。

    In this dissertation, a novel method using four electrodes perpendicular to shock front was proposed to measure the electrical conductivity of metals under shock compression up to megabar pressures.

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  • 完成整体结构圆片级真空封装的同时,通过线结构方便地实现了中间电极引线

    Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.

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  • 完成整体结构圆片级真空封装同时通过线结构方便实现了中间电极引线

    Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.

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  • 完成整体结构圆片级真空封装同时通过线结构方便实现了中间电极引线

    Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.

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