该模拟技术可以预测出具体工艺条件下电子束硬化层的深度、宽度和轮廓，并为选取合理的工艺规范提供指导。
It is shown that the simulating technology established can predict the depth, width and contour of hardened case and provide guide to select reasonable parameter.
该模拟技术可以预测出具体工艺条件下电子束硬化层的深度、宽度和轮廓，并为选取合理的工艺规范提供指导。
It is shown that the simulating technology established can predict the depth, width and contour of hardened case and provide guide to select reasonable parameter.
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