本文综述了电子封装技术的最新进展。
In this paper, new progress of electronic packaging technology is presented.
微电子连接技术是微电子封装技术中的重要环节。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。
The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。
Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。
Laser soldering technology has been found an important application in micro-electronic joining and packaging.
分立器件封装也是微电子生产技术的基础和先导。
Discrete device packaging is one of the basis and the pioneer of microelectronic technology.
本届研讨会是由国际微电子与封装协会主办的，每年一届，届时将有数百家参展商参加及很多技术会议。
The symposium is the annual meeting sponsored by the International Microelectronics and Packaging Society with hundreds of exhibitors and technical sessions.
曾任职上海新代车辆技术有限公司电子封装和质量中心部项目经理和技术经理；
She has been the project manager and technical manager of the packaging and quality center division of DaimlerChrysler SIM Technology.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
本文采用理论、数值模拟、实验等方法系统的研究了MEMS和光电子器件气密封装工艺中的关键技术问题。
This dissertation conduct fundamental research into several key issues of hermetic MEMS and optoelectronic devices by integrating theory, numerical simulation, and experiments.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
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