本发明所环氧树脂组合物可以有效地用于封装各种类型的半导体器件，如晶体管、集成电路。
The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits.
本发明所环氧树脂组合物可以有效地用于封装各种类型的半导体器件，如晶体管、集成电路。
The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits.
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