最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。
Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.
最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。
Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.
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