阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

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自动设备或手工层叠被用于将复合材料片层和金属配件排列成多层堆叠。

Automated equipment or hand lay-up are used to collate composite material plies and metal fittings into a multi-layer stack.

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每个堆叠包含所有片层，这些片层包括片层组合区域，这些片层在适当位置粘附在一起以保持取向和位置。

Each stack contains all plies, including ply build-up areas, tacked in the proper location to maintain orientation and location.

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每个堆叠包含所有片层，这些片层包括片层组合区域，这些片层在适当位置粘附在一起以保持取向和位置。

Each stack contains all plies, including ply build-up areas, tacked in the proper location to maintain orientation and location.

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